31 August 2026 to 4 September 2026
Queen Mary University of London, London, UK
Europe/London timezone

First evaluation of ColorPix-3 ASIC

2 Sept 2026, 13:09
1m
Graduate Centre Foyer / Engineering Foyer

Graduate Centre Foyer / Engineering Foyer

Poster Advances in Pixel Detectors & Integration Technologies Posters

Speakers

Jan Broulim (Czech Technical University in Prague (CZ)) Karolina Lavickova (Czech Technical University in Prague (CZ))

Description

In this contribution, we present the first characterization measurements of the ColorPix-3 ASIC integrated with the UniCorn readout interface. ColorPix-3 features a 32 × 32 pixel matrix with a pixel pitch of 70 μm and is designed for high-resolution, position-sensitive, and energy-resolved X-ray imaging. A 2 mm-thick CZT sensor layer is bump-bonded to the ASIC and serves as the detection medium, providing significantly higher X-ray and gamma-ray detection efficiency than conventional silicon-based sensors.

The ASIC records data in the form of hit counts across ten configurable energy thresholds. Due to device-to-device variations, several DAC parameters must be optimized prior to operation. We describe the complete calibration and equalization procedure, including threshold scans, pixel offset compensation, and energy-threshold calibration, followed by measurements performed under X-ray irradiation.

The experimental results confirm the intended functionality of the chip and demonstrate key detector characteristics, including charge-sharing effects between neighboring pixels. Finally, we discuss implications and the following applications.

Authors

Jan Broulim (Czech Technical University in Prague (CZ)) Karolina Lavickova (Czech Technical University in Prague (CZ)) Lukas Tomasek Maria Marcisovska Michal Marcisovsky Monika Kuncová Peter Svihra (Czech Academy of Sciences (CZ), Czech Technical University in Prague (CZ)) Radek Novotný Zdenko Janoska

Presentation materials