Login

2023 CAP Congress / Congrès de l'ACP 2023

18–23 Jun 2023
University of New Brunswick
America/Halifax timezone
Welcome to the 2023 CAP Congress Program website! / Bienvenue au siteweb du programme du Congrès de l'ACP 2023!

Support

Session

(DCMMP) T2-7 Quantum Materials Symposium | Symposium sur les matériaux quantiques (DPMCM)

T2-7
20 Jun 2023, 10:45
University of New Brunswick

University of New Brunswick

Conveners

(DCMMP) T2-7 Quantum Materials Symposium | Symposium sur les matériaux quantiques (DPMCM)

  • Ion Garate

Presentation materials

There are no materials yet.

  1. 3575. (I) Improving and Manipulating Majorana Zero Modes
    Tami Pereg-Barnea
    20/06/2023, 10:45
    Symposia Day (DCMMP - DPMCM) - Quantum Materials | Matériaux quantiques
    Invited Speaker / Conférencier(ère) invité(e)

    Majorana zero modes appear at the edges of topological superconducting wires as part of the bulk-boundary correspondence in these systems. Thanks to topology, Majoranas are robust against weak perturbations and this makes them promising candidates for qubit building blocks. In Majorana-based qubits quantum information is stored non-locally, avoiding many sources of decoherence. In such...

    Go to contribution page
  2. 3576. (I) 1D topological systems for next-generation electronics
    Prof. Judy J. Cha (Cornell University)
    20/06/2023, 11:15
    Symposia Day (DCMMP - DPMCM) - Quantum Materials | Matériaux quantiques
    Invited Speaker / Conférencier(ère) invité(e)

    Topological nanowires, topological materials confined in one dimension (1D), hold great promise for robust and scalable quantum computing and low-dissipation interconnect applications, which will transform current computing technologies. To do so, research in topological nanowires must continue to improve their synthesis and properties.

    In this talk, I will discuss my group’s efforts to...

    Go to contribution page
  3. 3673. (I) Exploring Unconventional Resistivity Scaling in Topological Semimetals for Interconnects Beyond Copper
    Ching-Tzu Chen (IBM TJ Watson Research Center)
    20/06/2023, 11:45
    Symposia Day (DCMMP - DPMCM) - Quantum Materials | Matériaux quantiques
    Invited Speaker / Conférencier(ère) invité(e)

    The scaling of interconnect wiring in integrated circuits leads to increasing resistivity of Cu wires and degrades the chip power-performance significantly. Current research on alternative interconnect conductors is largely limited to conventional metals for mitigating the growing line resistance. Here we explore topological conductors as a potential solution. Using CoSi and NbAs as examples,...

    Go to contribution page
  4. 3559. (G*) Tunnelling between a Weyl semimetal and a metallic band
    Leo Goutte
    20/06/2023, 12:15
    Symposia Day (DCMMP - DPMCM) - Quantum Materials | Matériaux quantiques
    Oral Competition (Graduate Student) / Compétition orale (Étudiant(e) du 2e ou 3e cycle)

    Weyl semimetals (WSMs) are materials whose low-energy excitations are Weyl fermions. Since its first observation in 2015, much work has gone into understanding the various properties of the WSM, most notably the Fermi arc -- a surface projection of the Berry flux connecting the WSM's zero-energy points. Here, we study the effects of tunnelling on the band structure and Fermi arc of a...

    Go to contribution page
Building timetable...