22–28 Jun 2019
DoubleTree at the Entrance to Universal Orlando
America/New_York timezone

Elastostatics in Beam Optics Analyzer

24 Jun 2019, 10:30
15m
Space Coast I-III (Double Tree at the Entrance to Universal)

Space Coast I-III

Double Tree at the Entrance to Universal

5780 Major Blvd. Orlando, Florida, 32819, USA
Oral 2.5 Codes and Modeling 2.5 Codes and Modeling

Speaker

Mr Thuc Bui (Calabazas Creek Research, Inc.)

Description

Calabazas Creek Research (CCR) developed and has maintained and continuously added new capabilities to Beam Optics Analyzer (BOA). It provides several finite element field solvers for electrostatics, heat transfer, magnetostatics and Helmholtz fields. It can track particles relativistically in either static or harmonic fields with space charge effects. It provides sophisticated emission models for field and thermionic emission. Its Mesher generates unstructured mesh with fine-grained control.
Using the power density generated by electrons depositing their energies on terminal electrodes, BOA can simulate the temperature profile of the device. This however does not provide a complete design loop. It would be ideal and much more efficient to compute the thermal stresses and predict the hot dimension of the electrodes on the same model and the same simulation platform. This would make a simulation tool, such as BOA, a complete multiphysics platform.
In a multiphysics platform, the same CAD model should be used for all analysis types from beam simulation to heat transfer and stress analysis. Parts required in one analysis type could be redundant in another. Thus, the analysts should be able to enable/disable parts as needed. Changing material in one part in one analysis type should be automatically carried over to other analysis types. BOA currently includes all the above convenient features for its particle beam and heat transfer analyses.
In the present work we extend BOA’s capability to include stress analysis. We will demonstrate seamless integration of the elastostatics field solver with beam simulation and heat transfer analysis. Integration of stress analysis into BOA provides a convenient, one-stop, multiphysics, simulation tool. It provides one package that can perform particle simulation, thermal and stress analysis using the same CAD model. We will present the finite element elastostatics formulation, particle, thermal and stress simulation results of a gridded triode gun.

Authors

Mr Thuc Bui (Calabazas Creek Research, Inc.) Dr R. Lawrence Ives (Calabazas Creek Research, Inc.) Mr David Marsden (Calabazas Creek Research, Inc.)

Presentation materials

There are no materials yet.